📋 Applications

💾 Semiconductor Chips
📷 Smartphone Camera Modules
👆 Fingerprint Modules
📱 HDI Boards
🔗 FPC (Flexible Circuits)
🏥 Medical Electronics
🚗 Automotive Electronics

⚙️ Technical Specifications

Parameter Specification
Platform Moving Range 600 × 400mm
Maximum Cutting Range Length 600mm × Width 400mm
Platform Positioning Accuracy ±3μm
Platform Repeat Positioning Accuracy ±2μm
CCD Positioning Accuracy <±5μm @ 1.3 Megapixels
Minimum Cutting Line Width <15μm
Cutting Dimension Precision ±25μm
Laser Output Power 25W / 30W / 40W UV
Equipment Dimensions 1750 × 1750 × 1700mm
Equipment Weight Approx. 1850kg
Work Station Type Dual-Station (Alternating Operation)

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