📋 Applications

💾 Semiconductor Chips
🔲 FPC Cover Layer Opening
🎨 Appearance Forming
PCBA Depaneling
🔬 Sensitive Components
🏥 Medical Electronics
📡 High-Density Boards

⚙️ Technical Specifications

Parameter Specification
Platform Moving Range 450 × 550mm
Maximum Cutting Range Length 550mm × Width 450mm
Platform Positioning Accuracy ±3μm
Platform Repeat Positioning Accuracy ±2μm
CCD Positioning Accuracy <±5μm
Minimum Cutting Line Width <15μm
Laser Output Power 25W / 30W / 40W UV
Equipment Dimensions 1750 × 1750 × 1700mm
Equipment Weight Approx. 1850kg
Work Station Type Single-Station Precision Cutting

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