UV PCB Depaneling Series
KL-5040 Dual-Station UV PCB Depaneling Machine
The KL-5040 is a dual-station UV laser PCB depaneling machine designed for zero-stress, non-contact separation of complex PCB panels. Using 355nm UV laser technology with ±3μm positioning accuracy, it delivers clean cuts on flex circuits, HDI boards, and sensitive assemblies without mechanical stress.
Model: KL-5040 | Professional Factory ManufacturingPlatform Size
600 × 400mmPrecision
±3μmLaser Power
25/30/40W UVDual Station
Alternating OperationIndustry-leading dual-station UV laser depaneling machine with alternating operation for maximum throughput. Features linear motor platform, marble anti-vibration base, and CAD import cutting capability.
Key Features
Dual-Station Alternating Operation - Maximize throughput with simultaneous loading and cutting on separate stations
UV Laser Cold Processing - Zero thermal stress for sensitive semiconductor and electronic components
Linear Motor Platform - High-speed, high-precision positioning for maximum efficiency
Marble Anti-Vibration Platform - Exceptional stability and damping for precision cuts
CAD Import Cutting - Direct import of CAD files for flexible, efficient programming
Why Choose KL-5040?
High Throughput: Dual-station design allows continuous production - load one station while cutting on the other
Premium Quality: Imported SCANLAB galvo, HIWIN linear motor, OMRON sensors for reliability
30+ Years Experience: Backed by nearly three decades of PCB depaneling expertise since 1995
Technical Specifications
| Parameter | Specification |
|---|---|
| Platform Moving Range | 600 × 400mm |
| Maximum Cutting Range | Length 600mm × Width 400mm |
| Platform Positioning Accuracy | ±3μm |
| Platform Repeat Positioning Accuracy | ±2μm |
| CCD Positioning Accuracy | <±5μm @ 1.3 Megapixels |
| Minimum Cutting Line Width | <15μm |
| Cutting Dimension Precision | ±25μm |
| Laser Output Power | 25W / 30W / 40W |
| Equipment Dimensions | 1750 × 1750 × 1700mm |
| Equipment Weight | Approx. 1850kg |
| Work Station Type | Dual-Station (Alternating Operation) |
Key Features
Dual-Station Alternating Operation - Maximize throughput with simultaneous loading and cutting
UV Laser Cold Processing - Zero thermal stress for sensitive components
Linear Motor Platform - High-speed, high-precision positioning
Marble Anti-Vibration Platform - Exceptional stability and damping
CAD Import Cutting - Direct import of CAD files for flexible programming
Premium Components - SCANLAB galvo, HIWIN linear motor, OMRON sensors
Application Areas
Semiconductor Chips
Smartphone Camera Modules
Fingerprint Modules
HDI Boards
FPC (Flexible Printed Circuits)
PCBA Depaneling
Medical Devices
Automotive Electronics
Frequently Asked Questions
The KL-5040 features a maximum cutting range of 600mm (length) × 400mm (width), with a platform moving range of 600×400mm. This makes it ideal for larger PCB panels used in smartphone and semiconductor manufacturing.
The KL-5040 achieves ±3μm platform positioning accuracy and ±2μm repeat positioning accuracy. The CCD vision system provides positioning accuracy of <±5μm at 1.3 megapixels. Minimum cutting line width is less than 15μm with ±25μm cutting dimension precision.
The dual-station design enables alternating operation where one worktable can be loaded/unloaded while the other is cutting, maximizing throughput and reducing idle time. This is particularly beneficial for high-volume production environments.
The KL-5040 is ideal for semiconductor chips, smartphone camera modules, fingerprint modules, HDI boards, FPC, and PCBA depaneling. Its UV cold processing technology ensures zero thermal stress on sensitive components.
The KL-5040 uses premium components: INNO UV laser (joint venture), SCANLAB precision galvo (imported), HIWIN linear motor (Taiwan), OMRON sensors (Japan), and HIKVISION CCD (domestic). The marble anti-vibration platform ensures exceptional stability.
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